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Electronic Pulp Product Classification
Pd/Ag Internal Electrode Pastes for Chip Components

It is used to make the inner electrode of PME-MLCC, chip varistor and multilayer piezoelectric ceramics.

Copper End-electrode Paste for MLCC

Used to make the end electrode of BME-MLCC.

Nickel Inner Electrode Paste for MLCC

Used to make the inner electrode of BME-MLCC.

Silver Electrode Paste

A silver electrode used to make devices such as capacitors, resistors and inductors

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Electronic Pulp Product List
Part NumberSmall ClassificationSolid contentviscosityFinenessProduct Category Full NameDatasheet
YP-1055 Silver Electrode Paste 60.5±1.0% 60.0～80.0Pa.s ≤7.0um/5.0um Electronic Paste
IT-3775 Silver Electrode Paste 78.5±1.5% 17.0～27.0Pa.s ≤10.0um Electronic Paste
IT-3775A Silver Electrode Paste 78.5±1.5% 17.0～27.0Pa.s ≤10.0um Electronic Paste
IL-1284G Silver Electrode Paste 83.0±1.0% 400.0～800.0Pa.s ≤7.0um/5.0um Electronic Paste
SGD-2088E Silver Electrode Paste 87.5±1.0% 200.0～450.0Pa.s ≤7.0um/5.0um Electronic Paste
SGD-2088D Silver Electrode Paste 87.5±1.0% 200.0～450.0Pa.s ≤7.0um/5.0um Electronic Paste
SGD-2088C Silver Electrode Paste 87.5±1.0% 200.0～450.0Pa.s ≤7.0um/5.0um Electronic Paste
SGD-2088B Silver Electrode Paste 87.5±1.0% 200.0～450.0Pa.s ≤7.0um/5.0um Electronic Paste
SGD-2088 Silver Electrode Paste 87.5±1.0% 200.0～450.0Pa.s ≤7.0um/5.0um Electronic Paste
SD-1081 Silver Electrode Paste 80.0±1.0% 100.0～300.0Pa.s ≤7.0um/5.0um Electronic Paste
IT-3760 Silver Electrode Paste 70.0±2.0% 21.0～35.0Pa.s ≤10.0um Electronic Paste
YP-5N Silver Electrode Paste 80.5±1.0% 50.0～90.0Pa.s ≤7.0um/5.0um Electronic Paste
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