FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC100JGT 10µH 5% 22 6.8
FHW1210HC100KGT 10µH 10% 22 6.8
FHW1008UC100JGT 10µH 5% 20 9.1
FHW1008UC100KGT 10µH 10% 20 9.1
FHW1210HC8R6JGT 8.6µH 5% 20 9
FHW1210HC8R6KGT 8.6µH 10% 20 9
FHW1210HC8R2KGT 8.2µH 10% 20 8.6
FHW1210HC8R2JGT 8.2µH 5% 20 8.6
FHW1008UC8R2JGT 8.2µH 5% 18 8.2
FHW1008UC8R2KGT 8.2µH 10% 18 8.2
FHW1210HC7R5JGT 7.5µH 5% 20 8.5
FHW1210HC7R5KGT 7.5µH 10% 20 8.5
FHW1008UC7R5KGT 7.5µH 10% 18 8
FHW1008UC7R5JGT 7.5µH 5% 18 8
FHW1210HC6R8JGT 6.8µH 5% 20 8
A total of 49 page 735 data