FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210IF151JST 150µH ±5% 8@0.796MHz 锡端头 9
FHW1210IF680JST 68µH ±5% 10@2.52MHz 锡端头 4.7
FHW1210IF390JST 39µH ±5% 10@2.52MHz 锡端头 4.7
FHW1210IF330JST 33µH ±5% 10@2.52MHz 锡端头 2.9
FHW0806PF100KST 10µH 锡端头
FHW1210HC100JGB 10µH ±5% 22@7.9MHz 20 6.8
FHW1210HC100KGT 10µH ±10% 22@7.9MHz 20 6.8
FHW1210HC100JGT 10µH ±5% 22@7.9MHz 20 6.8
FHW1008UC100KGT 10µH ±10% 20@7.9MHz 40 9.1
FHW1008UC100JGB 10µH ±5% 20@7.9MHz 40 9.1
FHW1008UC100JGT 10µH ±5% 20@7.9MHz 40 9.1
FHW1210IF8R2JST 8.2µH ±5% 12@7.96MHz 锡端头 1.6
FHW1210HC8R2KGT 8.2µH ±10% 20@7.9MHz 50 8.6
FHW1210HC8R2JST 8.2µH ±5% 20@7.9MHz 50 8.6
FHW1210HC8R2JGT 8.2µH ±5% 20@7.9MHz 50 8.6
A total of 60 page 894 data