FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HCR60GGT 600nH 2% 45 1.2
FHW1210HCR56GGT 560nH 2% 45 1.1
FHW1210HCR56JGT 560nH 5% 45 1.1
FHW1210HCR56KGT 560nH 10% 45 1.1
FHW1008UCR56JGT 560nH 5% 45 1.33
FHW1008UCR56GGT 560nH 2% 45 1.33
FHW1008UCR56KGT 560nH 10% 45 1.33
FHW0805UCR56KGT 560nH 10% 23 1.9
FHW0805UCR56JGT 560nH 5% 23 1.9
FHW1008UCR51KGT 510nH 10% 45 1.3
FHW1008UCR51GGT 510nH 2% 45 1.3
FHW1008UCR51JGT 510nH 5% 45 1.3
FHW1008UCR50KGT 500nH 10% 45 1.25
FHW1008UCR50GGT 500nH 2% 45 1.25
FHW1008UCR50JGT 500nH 5% 45 1.25
A total of 49 page 735 data