FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC1R5GGB 1.5µH ±2% 18@50MHz 170 2.8
FHW0805UC1R5KGB 1.5µH ±10% 18@50MHz 170 2.8
FHW1210HC1R2FGB 1.2µH 35@150MHz 220 1.87
FHW1210HC1R2JGB 1.2µH ±5% 35@150MHz 220 1.87
FHW1210HC1R2KGB 1.2µH ±10% 35@150MHz 220 1.87
FHW1210HC1R2KST 1.2µH ±10% 35@150MHz 220 1.87
FHW1210HC1R2GGT 1.2µH ±2% 35@150MHz 220 1.87
FHW1210HC1R2FGT 1.2µH 35@150MHz 220 1.87
FHW1210HC1R2KGT 1.2µH ±10% 35@150MHz 220 1.87
FHW1210HC1R2JGT 1.2µH ±5% 35@150MHz 220 1.87
FHW1210HC1R2KSB 1.2µH ±10% 35@150MHz 220 1.87
FHW1008UC1R2GGT 1.2µH ±2% 35@50MHz 200 2
FHW1008UC1R2KGB 1.2µH ±10% 35@50MHz 200 2
FHW1008UC1R2GGB 1.2µH ±2% 35@50MHz 200 2
FHW1008UC1R2KGT 1.2µH ±10% 35@50MHz 200 2
A total of 60 page 894 data