FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC1R2KGB 1.2µH ±10% 35@50MHz 200 2
FHW1008UC1R2GGB 1.2µH ±2% 35@50MHz 200 2
FHW1008UC1R2JSB 1.2µH ±5% 35@50MHz 200 2
FHW1008UC1R2JGB 1.2µH ±5% 35@50MHz 200 2
FHW0805UC1R2GGT 1.2µH ±2% 18@50MHz 180 2.55
FHW0805UC1R2JGTCAG 1.2µH ±5% 18@50MHz 180 2.55
FHW0805UC1R2JGTAEG 1.2µH ±5% 18@50MHz 180 2.55
FHW0805UC1R2KGT 1.2µH ±10% 18@50MHz 180 2.55
FHW0805UC1R2JGT 1.2µH ±5% 18@50MHz 180 2.55
FHW0805UC1R2JGB 1.2µH ±5% 18@50MHz 180 2.55
FHW0805UC1R2KGB 1.2µH ±10% 18@50MHz 180 2.55
FHW0805PF1R0KST 1.0µH 锡端头
FHW1210HC1R0GGT 1.0µH ±2% 45@150MHz 340 1.85
FHW1210HC1R0KGT 1.0µH ±10% 45@150MHz 340 1.85
FHW1210HC1R0JGT 1.0µH ±5% 45@150MHz 340 1.85
A total of 60 page 894 data