FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC1R0JGTCEG 1.0µH ±5% 20@50MHz 200 2.4
FHW0805UC1R0GGT 1.0µH ±2% 20@50MHz 200 2.4
FHW0805UC1R0KGB 1.0µH ±10% 20@50MHz 200 2.4
FHW0805UC1R0GGB 1.0µH ±2% 20@50MHz 200 2.4
FHW0805UC1R0JST 1.0µH ±5% 20@50MHz 200 2.4
FHW0805UC1R0FGT 1.0µH 20@50MHz 200 2.4
FHW0805UC1R0FGB 1.0µH 20@50MHz 200 2.4
FHW0805UC1R0JGT 1.0µH ±5% 20@50MHz 200 2.4
FHW0805UC1R0JGB 1.0µH ±5% 20@50MHz 200 2.4
FHW0805UC1R0KGT 1.0µH ±10% 20@50MHz 200 2.4
FHW0805UCR91JGB 910nH ±5% 20@50MHz 220 2.28
FHW0805UCR91JSB 910nH ±5% 20@50MHz 220 2.28
FHW0805UCR91JGT 910nH ±5% 20@50MHz 220 2.28
FHW0805UCR91KGB 910nH ±10% 20@50MHz 220 2.28
FHW0805UCR91JST 910nH ±5% 20@50MHz 220 2.28
A total of 60 page 894 data