FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HCR33JGT 330nH 5% 45 0.38
FHW1008UCR33KGT 330nH 10% 45 1.05
FHW1008UCR33JGT 330nH 5% 45 1.05
FHW1008UCR33GGT 330nH 2% 45 1.05
FHW0805UCR33JGT 330nH 5% 40 1.4
FHW0805UCR33KGT 330nH 10% 40 1.4
FHW0805UCR33GGT 330nH 2% 40 1.4
FHW0603UCR30KST 300nH 10% 24 3
FHW0603UCR30JST 300nH 5% 24 3
FHW0603UCR30GST 300nH 2% 24 3
FHW1210HCR30JGT 300nH 5% 45 0.35
FHW1210HCR30KGT 300nH 10% 45 0.35
FHW1210HCR30GGT 300nH 2% 45 0.35
FHW1008UCR30KGT 300nH 10% 45 1
FHW1008UCR30GGT 300nH 2% 45 1
A total of 49 page 735 data