FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR82GGT 820nH ±2% 23@50MHz 250 2.14
FHW0805UCR82KGT 820nH ±10% 23@50MHz 250 2.14
FHW0805UCR82JGT 820nH ±5% 23@50MHz 250 2.14
FHW0805UCR82JGTAEG 820nH ±5% 23@50MHz 250 2.14
FHW0805UCR82GGB 820nH ±2% 23@50MHz 250 2.14
FHW0805UCR82JGB 820nH ±5% 23@50MHz 250 2.14
FHW0805UCR82KGB 820nH ±10% 23@50MHz 250 2.14
FHW1210HCR75JGB 750nH ±5% 45@150MHz 380 1.7
FHW1210HCR75GGT 750nH ±2% 45@150MHz 380 1.7
FHW1210HCR75JGT 750nH ±5% 45@150MHz 380 1.7
FHW1210HCR75KGB 750nH ±10% 45@150MHz 380 1.7
FHW1210HCR75KGT 750nH ±10% 45@150MHz 380 1.7
FHW0805UCR75KGB 750nH ±10% 23@50MHz 280 2.12
FHW0805UCR75GGT 750nH ±2% 23@50MHz 280 2.12
FHW0805UCR75KGT 750nH ±10% 23@50MHz 280 2.12
A total of 60 page 894 data