FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UCR30JGT 300nH 5% 45 1
FHW0805UCR30GGT 300nH 2% 40 1.55
FHW0805UCR30JGT 300nH 5% 40 1.55
FHW0805UCR30KGT 300nH 10% 40 1.55
FHW0805UCR29GGT 290nH 2% 40 1.55
FHW0805UCR29KGT 290nH 10% 40 1.55
FHW0805UCR29JGT 290nH 5% 40 1.55
FHW0603UCR27KST 270nH 10% 24 2.3
FHW0603UCR27GST 270nH 2% 24 2.3
FHW0603UCR27JST 270nH 5% 24 2.3
FHW1210HCR27JGT 270nH 5% 55 0.34
FHW1210HCR27KGT 270nH 10% 55 0.34
FHW1210HCR27GGT 270nH 2% 55 0.34
FHW1008UCR27KGT 270nH 10% 45 0.91
FHW1008UCR27JGT 270nH 5% 45 0.91
A total of 49 page 735 data