FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UCR27GGT 270nH 2% 45 0.91
FHW0805UCR27GGT 270nH 2% 40 1.1
FHW0805UCR27KGT 270nH 10% 40 1.1
FHW0805UCR27JGT 270nH 5% 40 1.1
FHW0603UCR25KST 250nH 10% 25 3.55
FHW0603UCR25JST 250nH 5% 25 3.55
FHW0603UCR25GST 250nH 2% 25 3.55
FHW0805UCR25JGT 250nH 5% 40 1.4
FHW0805UCR25GGT 250nH 2% 40 1.4
FHW0805UCR25KGT 250nH 10% 40 1.4
FHW1210HCR24GGT 240nH 2% 60 0.32
FHW1210HCR24JGT 240nH 5% 60 0.32
FHW1210HCR24KGT 240nH 10% 60 0.32
FHW1008UCR24JGT 240nH 5% 45 0.88
FHW1008UCR24KGT 240nH 10% 45 0.88
A total of 49 page 735 data