FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR75KGT 750nH ±10% 23@50MHz 280 2.12
FHW0805UCR75JGB 750nH ±5% 23@50MHz 280 2.12
FHW1210HCR68KGB 680nH ±10% 45@150MHz 400 1.2
FHW1210HCR68GGT 680nH ±2% 45@150MHz 400 1.2
FHW1210HCR68JGT 680nH ±5% 45@150MHz 400 1.2
FHW1210HCR68JGB 680nH ±5% 45@150MHz 400 1.2
FHW1210HCR68KGT 680nH ±10% 45@150MHz 400 1.2
FHW1210HCR68MGT 680nH ±20% 45@150MHz 400 1.2
FHW1008UCR68GGB 680nH ±2% 45@100MHz 375 1.47
FHW1008UCR68FGB 680nH 45@100MHz 375 1.47
FHW1008UCR68FGT 680nH 45@100MHz 375 1.47
FHW1008UCR68KGT 680nH ±10% 45@100MHz 375 1.47
FHW1008UCR68JGT 680nH ±5% 45@100MHz 375 1.47
FHW1008UCR68GGT 680nH ±2% 45@100MHz 375 1.47
FHW1008UCR68JGB 680nH ±5% 45@100MHz 375 1.47
A total of 60 page 894 data