FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UCR56KGB 560nH ±10% 45@100MHz 415 1.33
FHW1008UCR56JGTAEG 560nH ±5% 45@100MHz 415 1.33
FHW1008UCR56FGB 560nH 45@100MHz 415 1.33
FHW1008UCR56FGT 560nH 45@100MHz 415 1.33
FHW1008UCR56JGB 560nH ±5% 45@100MHz 415 1.33
FHW1008UCR56JGT 560nH ±5% 45@100MHz 415 1.33
FHW1008UCR56GGT 560nH ±2% 45@100MHz 415 1.33
FHW1008UCR56KGT 560nH ±10% 45@100MHz 415 1.33
FHW0805UCR56JGTAEG 560nH ±5% 23@50MHz 340 1.9
FHW0805UCR56JGTEEG 560nH ±5% 23@50MHz 340 1.9
FHW0805UCR56GGT 560nH ±2% 23@50MHz 340 1.9
FHW0805UCR56KGT 560nH ±10% 23@50MHz 340 1.9
FHW0805UCR56KGB 560nH ±10% 23@50MHz 340 1.9
FHW0805UCR56JGB 560nH ±5% 23@50MHz 340 1.9
FHW0805UCR56JGT 560nH ±5% 23@50MHz 340 1.9
A total of 60 page 894 data