FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC8R2JST 8.2µH ±5% 20@7.9MHz 50 8.6
FHW1210HC8R2JGT 8.2µH ±5% 20@7.9MHz 50 8.6
FHW1008UC8R2JGT 8.2µH ±5% 18@7.9MHz 40 8.2
FHW1008UC8R2JGB 8.2µH ±5% 18@7.9MHz 40 8.2
FHW1008UC8R2KGT 8.2µH ±10% 18@7.9MHz 40 8.2
FHW1210IF6R8JST 6.8µH ±5% 12@7.96MHz 锡端头 1.5
FHW1210HC6R8JGT 6.8µH ±5% 20@7.9MHz 55 8
FHW1210HC6R8KGT 6.8µH ±10% 20@7.9MHz 55 8
FHW1210HC6R8KGB 6.8µH ±10% 20@7.9MHz 55 8
FHW1210HC6R8JGB 6.8µH ±5% 20@7.9MHz 55 8
FHW1008UC6R8KGB 6.8µH ±10% 18@7.9MHz 50 8.2
FHW1008UC6R8JGB 6.8µH ±5% 18@7.9MHz 50 8.2
FHW1008UC6R8KGT 6.8µH ±10% 18@7.9MHz 50 8.2
FHW1008UC6R8JGT 6.8µH ±5% 18@7.9MHz 50 8.2
FHW1210HC5R6KGB 5.6µH ±10% 20@7.9MHz 60 5
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