FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR12GGT 120nH 2% 45 0.51
FHW0805UCR12KGT 120nH 10% 45 0.51
FHW0805UCR12JGT 120nH 5% 45 0.51
FHW0603UCR11JST 110nH 5% 32 0.67
FHW0603UCR11GST 110nH 2% 32 0.67
FHW0603UCR11KST 110nH 10% 32 0.67
FHW1008UCR11GGT 110nH 2% 60 0.6
FHW1008UCR11JGT 110nH 5% 60 0.6
FHW1008UCR11KGT 110nH 10% 60 0.6
FHW0805UCR11JGT 110nH 5% 45 0.51
FHW0805UCR11KGT 110nH 10% 45 0.51
FHW0805UCR11GGT 110nH 2% 45 0.51
FHW0603UCR10JST 100nH 5% 30 0.63
FHW0603UCR10GST 100nH 2% 30 0.63
FHW0603UCR10KST 100nH 10% 30 0.63
A total of 49 page 735 data