FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR39JGB 390nH ±5% 40@250MHz 560 1.5
FHW0805UCR39HGT 390nH ±3% 40@250MHz 560 1.5
FHW0805UCR39JGTCEG 390nH ±5% 40@250MHz 560 1.5
FHW0603UCR36JST 360nH 锡端头
FHW1210HCR33JGB 330nH ±5% 45@150MHz 600 0.38
FHW1210HCR33KGB 330nH ±10% 45@150MHz 600 0.38
FHW1210HCR33JGT 330nH ±5% 45@150MHz 600 0.38
FHW1210HCR33KGT 330nH ±10% 45@150MHz 600 0.38
FHW1210HCR33FGB 330nH 45@150MHz 600 0.38
FHW1210HCR33GGT 330nH ±2% 45@150MHz 600 0.38
FHW1008UCR33KST 330nH ±10% 45@100MHz 500 1.05
FHW1008UCR33FGT 330nH 45@100MHz 500 1.05
FHW1008UCR33FGB 330nH 45@100MHz 500 1.05
FHW1008UCR33GGB 330nH ±2% 45@100MHz 500 1.05
FHW1008UCR33KGT 330nH ±10% 45@100MHz 500 1.05
A total of 60 page 894 data