FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HCR10KGT 100nH 10% 55 0.21
FHW1210HCR10JGT 100nH 5% 55 0.21
FHW1210HCR10GGT 100nH 2% 55 0.21
FHW1008UCR10KGT 100nH 10% 60 0.56
FHW1008UCR10GGT 100nH 2% 60 0.56
FHW1008UCR10JGT 100nH 5% 60 0.56
FHW0805UCR10GGT 100nH 2% 50 0.46
FHW0805UCR10KGT 100nH 10% 50 0.46
FHW0805UCR10JGT 100nH 5% 50 0.46
FHW0805UC095JGT 95nH 5% 50 0.46
FHW0805UC095KGT 95nH 10% 50 0.46
FHW0805UC095GGT 95nH 2% 50 0.46
FHW0603UC091JST 91nH 5% 30 0.63
FHW0603UC091KST 91nH 10% 30 0.63
FHW0603UC091GST 91nH 2% 30 0.63
A total of 49 page 735 data