FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UCR33FGT 330nH 45@100MHz 500 1.05
FHW1008UCR33KGB 330nH ±10% 45@100MHz 500 1.05
FHW1008UCR33GGT 330nH ±2% 45@100MHz 500 1.05
FHW1008UCR33JGT 330nH ±5% 45@100MHz 500 1.05
FHW0805UCR33HGT 330nH ±3% 40@250MHz 600 1.4
FHW0805UCR33JGTCEG 330nH ±5% 40@250MHz 600 1.4
FHW0805UCR33JST 330nH ±5% 40@250MHz 600 1.4
FHW0805UCR33KGB 330nH ±10% 40@250MHz 600 1.4
FHW0805UCR33GGB 330nH ±2% 40@250MHz 600 1.4
FHW0805UCR33JGT 330nH ±5% 40@250MHz 600 1.4
FHW0805UCR33GGT 330nH ±2% 40@250MHz 600 1.4
FHW0805UCR33SGT 330nH ±0.3nH 40@250MHz 600 1.4
FHW0805UCR33KGT 330nH ±10% 40@250MHz 600 1.4
FHW0805UCR33KST 330nH ±10% 40@250MHz 600 1.4
FHW0805UCR33JGB 330nH ±5% 40@250MHz 600 1.4
A total of 60 page 894 data