FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC082KGT 82nH 10% 55 0.2
FHW1210HC082JGT 82nH 5% 55 0.2
FHW1210HC082GGT 82nH 2% 55 0.2
FHW1008UC082KGT 82nH 10% 60 0.22
FHW1008UC082GGT 82nH 2% 60 0.22
FHW1008UC082JGT 82nH 5% 60 0.22
FHW0805UC082KGT 82nH 10% 55 0.42
FHW0805UC082GGT 82nH 2% 55 0.42
FHW0805UC082JGT 82nH 5% 55 0.42
FHW0805UC078GGT 78nH 2% 55 0.42
FHW0805UC078JGT 78nH 5% 55 0.42
FHW0805UC078KGT 78nH 10% 55 0.42
FHW0603UC075GST 75nH 2% 30 0.6
FHW0603UC075JST 75nH 5% 30 0.6
FHW0603UC075KST 75nH 10% 30 0.6
A total of 49 page 735 data