FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR27KGT 270nH ±10% 40@250MHz 650 1.1
FHW0805UCR27JGT 270nH ±5% 40@250MHz 650 1.1
FHW0805UCR27GGTEAG 270nH ±2% 40@250MHz 650 1.1
FHW0805UCR27JGTCEG 270nH ±5% 40@250MHz 650 1.1
FHW0805UCR27GGB 270nH ±2% 40@250MHz 650 1.1
FHW0805UCR27KGB 270nH ±10% 40@250MHz 650 1.1
FHW0805UCR27JGB 270nH ±5% 40@250MHz 650 1.1
FHW0805UCR27JGTEAG 270nH ±5% 40@250MHz 650 1.1
FHW0805UCR27HGT 270nH ±3% 40@250MHz 650 1.1
FHW0805UCR27GGTAEG 270nH ±2% 40@250MHz 650 1.1
FHW0805UCR27JGTFEG 270nH ±5% 40@250MHz 650 1.1
FHW0805UCR27JGTAEG 270nH ±5% 40@250MHz 650 1.1
FHW1210HCR22JGB 220nH ±5% 60@300MHz 650 0.32
FHW1210HCR22FGB 220nH 60@300MHz 650 0.32
FHW1210HCR22JGT 220nH ±5% 60@300MHz 650 0.32
A total of 60 page 894 data