FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR22JGTCEG 220nH ±5% 40@250MHz 850 1.05
FHW0805UCR22JGT 220nH ±5% 40@250MHz 850 1.05
FHW0805UCR22JGTEAG 220nH ±5% 40@250MHz 850 1.05
FHW0805UCR22KST 220nH ±10% 40@250MHz 850 1.05
FHW0805UCR22GGB 220nH ±2% 40@250MHz 850 1.05
FHW0805UCR22HGT 220nH ±3% 40@250MHz 850 1.05
FHW0805UCR22KGT 220nH ±10% 40@250MHz 850 1.05
FHW0805UCR22JGTAEG 220nH ±5% 40@250MHz 850 1.05
FHW0805UCR22JGTEEG 220nH ±5% 40@250MHz 850 1.05
FHW0805UCR22JGB 220nH ±5% 40@250MHz 850 1.05
FHW0805UCR22KGB 220nH ±10% 40@250MHz 850 1.05
FHW0805UCR22GGT 220nH ±2% 40@250MHz 850 1.05
FHW0805UCR22SGT 220nH ±0.3nH 40@250MHz 850 1.05
FHW0805UCR22GGTAEG 220nH ±2% 40@250MHz 850 1.05
FHW1210HCR18JGT 180nH ±5% 60@300MHz 760 0.3
A total of 60 page 894 data