FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HCR18JGB 180nH ±5% 60@300MHz 760 0.3
FHW1210HCR18FGB 180nH 60@300MHz 760 0.3
FHW1210HCR18KGT 180nH ±10% 60@300MHz 760 0.3
FHW1210HCR18JGT 180nH ±5% 60@300MHz 760 0.3
FHW1210HCR18GGT 180nH ±2% 60@300MHz 760 0.3
FHW1008UCR18GST 180nH ±2% 45@100MHz 640 0.77
FHW1008UCR18JGT 180nH ±5% 45@100MHz 640 0.77
FHW1008UCR18JGB 180nH ±5% 45@100MHz 640 0.77
FHW1008UCR18KGB 180nH ±10% 45@100MHz 640 0.77
FHW1008UCR18GGT 180nH ±2% 45@100MHz 640 0.77
FHW1008UCR18GGB 180nH ±2% 45@100MHz 640 0.77
FHW1008UCR18KGT 180nH ±10% 45@100MHz 640 0.77
FHW1008UCR18FGT 180nH 45@100MHz 640 0.77
FHW1008UCR18FGB 180nH 45@100MHz 640 0.77
FHW0805UCR18JGB 180nH ±5% 45@250MHz 870 0.64
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