FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC3R9GGT 3.9µH 2% 20 3.6
FHW1210HC3R9JGT 3.9µH 5% 20 3.6
FHW1008UC3R9KGT 3.9µH 10% 16 3.6
FHW1008UC3R9JGT 3.9µH 5% 16 3.6
FHW1008UC3R9GGT 3.9µH 2% 16 3.6
FHW1210HC3R5KGT 3.5µH 10% 20 3.2
FHW1210HC3R5JGT 3.5µH 5% 20 3.2
FHW1210HC3R5GGT 3.5µH 2% 20 3.2
FHW1210HC3R3JGT 3.3µH 5% 20 3.12
FHW1210HC3R3KGT 3.3µH 10% 20 3.12
FHW1210HC3R3GGT 3.3µH 2% 20 3.12
FHW1008UC3R3KGT 3.3µH 10% 22 3.4
FHW1008UC3R3JGT 3.3µH 5% 22 3.4
FHW1008UC3R3GGT 3.3µH 2% 22 3.4
FHW1008UC3R0GGT 3.0µH 2% 22 3.3
A total of 49 page 735 data