FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC5R6JGB 5.6µH ±5% 20@7.9MHz 60 5
FHW1210HC5R6KGT 5.6µH ±10% 20@7.9MHz 60 5
FHW1210HC5R6JGT 5.6µH ±5% 20@7.9MHz 60 5
FHW1008UC5R6KGT 5.6µH ±10% 18@7.9MHz 55 7.6
FHW1008UC5R6KGB 5.6µH ±10% 18@7.9MHz 55 7.6
FHW1008UC5R6JGB 5.6µH ±5% 18@7.9MHz 55 7.6
FHW1008UC5R6JGT 5.6µH ±5% 18@7.9MHz 55 7.6
FHW0805PF4R7KST 4.7µH 锡端头
FHW0604PF4R7KST 4.7µH 锡端头
FHW0604PF4R7KST-WIP 4.7µH 锡端头
FHW0604PF4R7KST-ZWIP 4.7µH 锡端头
FHW1210HC4R7KGT 4.7µH ±10% 16@25MHz 60 4
FHW1210HC4R7JGT 4.7µH ±5% 16@25MHz 60 4
FHW1210HC4R7JGB 4.7µH ±5% 16@25MHz 60 4
FHW1210HC4R7KGB 4.7µH ±10% 16@25MHz 60 4
A total of 60 page 894 data