FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR15GGTAEG 150nH ±2% 45@250MHz 920 0.56
FHW1210HCR12JGT 120nH ±5% 60@300MHz 800 0.21
FHW1210HCR12JGB 120nH ±5% 60@300MHz 800 0.21
FHW1210HCR12KGB 120nH ±10% 60@300MHz 800 0.21
FHW1210HCR12GTT 120nH ±2% 60@300MHz 800 0.21
FHW1210HCR12GGB 120nH ±2% 60@300MHz 800 0.21
FHW1210HCR12GTB 120nH ±2% 60@300MHz 800 0.21
FHW1210HCR12GGT 120nH ±2% 60@300MHz 800 0.21
FHW1210HCR12FGB 120nH 60@300MHz 800 0.21
FHW1210HCR12KGT 120nH ±10% 60@300MHz 800 0.21
FHW1008UCR12JGT 120nH ±5% 60@350MHz 950 0.63
FHW1008UCR12FGT 120nH 60@350MHz 950 0.63
FHW1008UCR12JGTBAA 120nH ±5% 60@350MHz 950 0.63
FHW1008UCR12GGT 120nH ±2% 60@350MHz 950 0.63
FHW1008UCR12JGB 120nH ±5% 60@350MHz 950 0.63
A total of 60 page 894 data