FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UCR12FGT 120nH 60@350MHz 950 0.63
FHW1008UCR12GGT 120nH ±2% 60@350MHz 950 0.63
FHW1008UCR12KGB 120nH ±10% 60@350MHz 950 0.63
FHW1008UCR12FGB 120nH 60@350MHz 950 0.63
FHW0805UCR12GGTBEG 120nH ±2% 45@250MHz 1100 0.51
FHW0805UCR12GGB 120nH ±2% 45@250MHz 1100 0.51
FHW0805UCR12KGT 120nH ±10% 45@250MHz 1100 0.51
FHW0805UCR12GGT 120nH ±2% 45@250MHz 1100 0.51
FHW0805UCR12HGT 120nH ±3% 45@250MHz 1100 0.51
FHW0805UCR12JGT 120nH ±5% 45@250MHz 1100 0.51
FHW0805UCR12KGB 120nH ±10% 45@250MHz 1100 0.51
FHW0805UCR12JGB 120nH ±5% 45@250MHz 1100 0.51
FHW1210HCR10FGB 100nH 55@300MHz 900 0.21
FHW1210HCR10KGB 100nH ±10% 55@300MHz 900 0.21
FHW1210HCR10JGB 100nH ±5% 55@300MHz 900 0.21
A total of 60 page 894 data