FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HCR10KGT 100nH ±10% 55@300MHz 900 0.21
FHW1210HCR10FGT 100nH 55@300MHz 900 0.21
FHW1210HCR10GGT 100nH ±2% 55@300MHz 900 0.21
FHW1210HCR10JGB 100nH ±5% 55@300MHz 900 0.21
FHW1008UCR10GGT 100nH ±2% 60@350MHz 1000 0.56
FHW1008UCR10FGT 100nH 60@350MHz 1000 0.56
FHW1008UCR10JST 100nH ±5% 60@350MHz 1000 0.56
FHW1008UCR10KGB 100nH ±10% 60@350MHz 1000 0.56
FHW1008UCR10JGB 100nH ±5% 60@350MHz 1000 0.56
FHW1008UCR10KGT 100nH ±10% 60@350MHz 1000 0.56
FHW1008UCR10JSB 100nH ±5% 60@350MHz 1000 0.56
FHW1008UCR10GGB 100nH ±2% 60@350MHz 1000 0.56
FHW1008UCR10FGB 100nH 60@350MHz 1000 0.56
FHW1008UCR10JGT 100nH ±5% 60@350MHz 1000 0.56
FHW0805UCR10JST 100nH ±5% 50@500MHz 1200 0.46
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