FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

；

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


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FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR10JGTAEG 100nH ±5% 50@500MHz 1200 0.46
FHW0805UCR10JST 100nH ±5% 50@500MHz 1200 0.46
FHW0805UCR10GGT 100nH ±2% 50@500MHz 1200 0.46
FHW0805UCR10KGB 100nH ±10% 50@500MHz 1200 0.46
FHW0805UCR10GGB 100nH ±2% 50@500MHz 1200 0.46
FHW0805UCR10GGTDEG 100nH ±2% 50@500MHz 1200 0.46
FHW0805UCR10KGT 100nH ±10% 50@500MHz 1200 0.46
FHW0805UCR10FGT 100nH 50@500MHz 1200 0.46
FHW0805UCR10FGB 100nH 50@500MHz 1200 0.46
FHW0805UCR10JGT 100nH ±5% 50@500MHz 1200 0.46
FHW0805UCR10JGB 100nH ±5% 50@500MHz 1200 0.46
FHW1210HC082KGT 82nH ±10% 55@300MHz 1000 0.2
FHW1210HC082JGB 82nH ±5% 55@300MHz 1000 0.2
FHW1210HC082KGB 82nH ±10% 55@300MHz 1000 0.2
FHW1210HC082JGT 82nH ±5% 55@300MHz 1000 0.2
A total of 60 page 894 data