FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC082KGB 82nH ±10% 55@300MHz 1000 0.2
FHW1008UC082GST 82nH ±2% 60@350MHz 1000 0.22
FHW1008UC082MGT 82nH ±20% 60@350MHz 1000 0.22
FHW1008UC082JGT 82nH ±5% 60@350MHz 1000 0.22
FHW1008UC082KGT 82nH ±10% 60@350MHz 1000 0.22
FHW1008UC082GGT 82nH ±2% 60@350MHz 1000 0.22
FHW1008UC082MGB 82nH ±20% 60@350MHz 1000 0.22
FHW1008UC082FGB 82nH 60@350MHz 1000 0.22
FHW1008UC082FGT 82nH 60@350MHz 1000 0.22
FHW1008UC082JGB 82nH ±5% 60@350MHz 1000 0.22
FHW1008UC082KGB 82nH ±10% 60@350MHz 1000 0.22
FHW0805UC082GGTDEG 82nH ±2% 55@500MHz 1300 0.42
FHW0805UC082JGT 82nH ±5% 55@500MHz 1300 0.42
FHW0805UC082GGB 82nH ±2% 55@500MHz 1300 0.42
FHW0805UC082KGB 82nH ±10% 55@500MHz 1300 0.42
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