FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC082KGT 82nH ±10% 55@500MHz 1300 0.42
FHW0805UC082GGB 82nH ±2% 55@500MHz 1300 0.42
FHW0805UC082JGTAEG 82nH ±5% 55@500MHz 1300 0.42
FHW0805UC082GST 82nH ±2% 55@500MHz 1300 0.42
FHW0805UC082GGT 82nH ±2% 55@500MHz 1300 0.42
FHW0805UC075JGT 75nH ±5% 55@500MHz 1400 0.4
FHW0805UC075KGT 75nH ±10% 55@500MHz 1400 0.4
FHW0805UC075GGT 75nH ±2% 55@500MHz 1400 0.4
FHW0805UC075JGTAEG 75nH ±5% 55@500MHz 1400 0.4
FHW0805UC075KGB 75nH ±10% 55@500MHz 1400 0.4
FHW0805UC075JGB 75nH ±5% 55@500MHz 1400 0.4
FHW1210HC068GGT 68nH ±2% 55@300MHz 1200 0.15
FHW1210HC068JGB 68nH ±5% 55@300MHz 1200 0.15
FHW1210HC068KGB 68nH ±10% 55@300MHz 1200 0.15
FHW1210HC068JGT 68nH ±5% 55@300MHz 1200 0.15
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