FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC068JGT 68nH ±5% 55@300MHz 1200 0.15
FHW1008UC068MGB 68nH ±20% 65@350MHz 1000 0.2
FHW1008UC068JGB 68nH ±5% 65@350MHz 1000 0.2
FHW1008UC068GGT 68nH ±2% 65@350MHz 1000 0.2
FHW1008UC068MGT 68nH ±20% 65@350MHz 1000 0.2
FHW1008UC068KGT 68nH ±10% 65@350MHz 1000 0.2
FHW1008UC068JGT 68nH ±5% 65@350MHz 1000 0.2
FHW1008UC068KGB 68nH ±10% 65@350MHz 1000 0.2
FHW0805UC068MGT 68nH ±20% 55@500MHz 1450 0.38
FHW0805UC068KGB 68nH ±10% 55@500MHz 1450 0.38
FHW0805UC068MGB 68nH ±20% 55@500MHz 1450 0.38
FHW0805UC068GGT 68nH ±2% 55@500MHz 1450 0.38
FHW0805UC068JGTAEG 68nH ±5% 55@500MHz 1450 0.38
FHW0805UC068FGT 68nH 55@500MHz 1450 0.38
FHW0805UC068KGT 68nH ±10% 55@500MHz 1450 0.38
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