FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC4R7KGT 4.7µH ±10% 18@25MHz 60 4
FHW1008UC4R7JGB 4.7µH ±5% 18@25MHz 60 4
FHW1008UC4R7JGT 4.7µH ±5% 18@25MHz 60 4
FHW1008UC4R7GGT 4.7µH ±2% 18@25MHz 60 4
FHW1008UC4R7KGB 4.7µH ±10% 18@25MHz 60 4
FHW1008UC4R7GGB 4.7µH ±2% 18@25MHz 60 4
FHW1210HC3R9KGB 3.9µH ±10% 20@25MHz 80 3.6
FHW1210HC3R9FGB 3.9µH 20@25MHz 80 3.6
FHW1210HC3R9JGB 3.9µH ±5% 20@25MHz 80 3.6
FHW1210HC3R9JGT 3.9µH ±5% 20@25MHz 80 3.6
FHW1210HC3R9FGT 3.9µH 20@25MHz 80 3.6
FHW1210HC3R9GGT 3.9µH ±2% 20@25MHz 80 3.6
FHW1210HC3R9KGT 3.9µH ±10% 20@25MHz 80 3.6
FHW1008UC3R9KGT 3.9µH ±10% 16@25MHz 60 3.6
FHW1008UC3R9JGT 3.9µH ±5% 16@25MHz 60 3.6
A total of 60 page 894 data