FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC056KGB 56nH ±10% 65@350MHz 1100 0.18
FHW1008UC056MGB 56nH ±20% 65@350MHz 1100 0.18
FHW1008UC056GGB 56nH ±2% 65@350MHz 1100 0.18
FHW0805UC056GGT 56nH ±2% 55@500MHz 1550 0.34
FHW0805UC056KGB 56nH ±10% 55@500MHz 1550 0.34
FHW0805UC056JGB 56nH ±5% 55@500MHz 1550 0.34
FHW0805UC056GGB 56nH ±2% 55@500MHz 1550 0.34
FHW0805UC056JGTAEG 56nH ±5% 55@500MHz 1550 0.34
FHW0805UC056JGT 56nH ±5% 55@500MHz 1550 0.34
FHW0805UC056KGT 56nH ±10% 55@500MHz 1550 0.34
FHW0805UC056HGT 56nH ±3% 55@500MHz 1550 0.34
FHW1210HC047KGT 47nH ±10% 55@300MHz 1500 0.13
FHW1210HC047GGT 47nH ±2% 55@300MHz 1500 0.13
FHW1210HC047JGB 47nH ±5% 55@300MHz 1500 0.13
FHW1210HC047KGB 47nH ±10% 55@300MHz 1500 0.13
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