FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC047KGT 47nH ±10% 55@500MHz 1650 0.31
FHW0805UC047GGT 47nH ±2% 55@500MHz 1650 0.31
FHW0805UC047KGB 47nH ±10% 55@500MHz 1650 0.31
FHW0805UC047GST 47nH ±2% 55@500MHz 1650 0.31
FHW0805UC047JGTCEG 47nH ±5% 55@500MHz 1650 0.31
FHW1210HC039JGT 39nH ±5% 55@300MHz 1800 0.12
FHW1210HC039JGB 39nH ±5% 55@300MHz 1800 0.12
FHW1210HC039KGB 39nH ±10% 55@300MHz 1800 0.12
FHW1210HC039KGT 39nH ±10% 55@300MHz 1800 0.12
FHW1210HC039GGT 39nH ±2% 55@300MHz 1800 0.12
FHW1008UC039MGT 39nH ±20% 60@350MHz 1500 0.15
FHW1008UC039KGT 39nH ±10% 60@350MHz 1500 0.15
FHW1008UC039JGT 39nH ±5% 60@350MHz 1500 0.15
FHW1008UC039GGB 39nH ±2% 60@350MHz 1500 0.15
FHW1008UC039MGB 39nH ±20% 60@350MHz 1500 0.15
A total of 60 page 894 data