FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0603UC010GST 10nH 2% 31 0.13
FHW0603UC010KST 10nH 10% 31 0.13
FHW1210HC010JGT 10nH 5% 40 0.08
FHW1210HC010KGT 10nH 10% 40 0.08
FHW1210HC010GGT 10nH 2% 40 0.08
FHW1008UC010JGT 10nH 5% 50 0.08
FHW1008UC010GGT 10nH 2% 50 0.08
FHW1008UC010KGT 10nH 10% 50 0.08
FHW0805UC010GGT 10nH 2% 50 0.15
FHW0805UC010JGT 10nH 5% 50 0.15
FHW0805UC010KGT 10nH 10% 50 0.15
FHW0603UC9N5GST 9.5nH 2% 26 0.15
FHW0603UC9N5JST 9.5nH 5% 26 0.15
FHW0603UC9N5KST 9.5nH 10% 26 0.15
FHW0603UC9N1KST 9.1nH 10% 26 0.15
A total of 49 page 735 data