FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC039JGT 39nH ±5% 60@350MHz 1500 0.15
FHW1008UC039GGB 39nH ±2% 60@350MHz 1500 0.15
FHW1008UC039MGT 39nH ±20% 60@350MHz 1500 0.15
FHW1008UC039MGB 39nH ±20% 60@350MHz 1500 0.15
FHW1008UC039JSTAEG 39nH ±5% 60@350MHz 1500 0.15
FHW0805UC039JGTAEG 39nH ±5% 55@500MHz 2000 0.29
FHW0805UC039JGT 39nH ±5% 55@500MHz 2000 0.29
FHW0805UC039MGT 39nH ±20% 55@500MHz 2000 0.29
FHW0805UC039GGT 39nH ±2% 55@500MHz 2000 0.29
FHW0805UC039JGB 39nH ±5% 55@500MHz 2000 0.29
FHW0805UC039MGB 39nH ±20% 55@500MHz 2000 0.29
FHW0805UC039KGB 39nH ±10% 55@500MHz 2000 0.29
FHW0805UC039KGT 39nH ±10% 55@500MHz 2000 0.29
FHW1210HC033KGT 33nH ±10% 55@300MHz 1800 0.11
FHW1210HC033GGT 33nH ±2% 55@300MHz 1800 0.11
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