FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0603UC9N1JST 9.1nH 5% 26 0.15
FHW0603UC9N1KST 9.1nH 10% 26 0.15
FHW0603UC8N7GST 8.7nH 2% 28 0.12
FHW0603UC8N7KST 8.7nH 10% 28 0.12
FHW0603UC8N7JST 8.7nH 5% 28 0.12
FHW0603UC8N2JST 8.2nH 5% 28 0.12
FHW0603UC8N2GST 8.2nH 2% 28 0.12
FHW0603UC8N2KST 8.2nH 10% 28 0.12
FHW1210HC8N2KGT 8.2nH 10% 30 0.07
FHW0805UC8N2GGT 8.2nH 2% 35 0.2
FHW0805UC8N2JGT 8.2nH 5% 35 0.2
FHW0805UC8N2KGT 8.2nH 10% 35 0.2
FHW0805UC7N8GGT 7.8nH 2% 35 0.2
FHW0805UC7N8JGT 7.8nH 5% 35 0.2
FHW0805UC7N8KGT 7.8nH 10% 35 0.2
A total of 49 page 735 data