FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

；

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


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FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC033KGB 33nH ±10% 60@350MHz 1600 0.14
FHW0805UC033GGT 33nH ±2% 55@500MHz 2050 0.27
FHW0805UC033KGT 33nH ±10% 55@500MHz 2050 0.27
FHW0805UC033JGT 33nH ±5% 55@500MHz 2050 0.27
FHW0805UC033JGB 33nH ±5% 55@500MHz 2050 0.27
FHW0805UC033MGT 33nH ±20% 55@500MHz 2050 0.27
FHW0805UC033MGB 33nH ±20% 55@500MHz 2050 0.27
FHW0805UC033GGB 33nH ±2% 55@500MHz 2050 0.27
FHW0805UC033JGTAEG 33nH ±5% 55@500MHz 2050 0.27
FHW0805UC033KGB 33nH ±10% 55@500MHz 2050 0.27
FHW0805UC033GST 33nH ±2% 55@500MHz 2050 0.27
FHW1210HC027KGB 27nH ±10% 50@300MHz 1800 0.11
FHW1210HC027JGT 27nH ±5% 50@300MHz 1800 0.11
FHW1210HC027GGT 27nH ±2% 50@300MHz 1800 0.11
FHW1210HC027JGB 27nH ±5% 50@300MHz 1800 0.11
A total of 59 page 885 data