FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0603UC7N5KST 7.5nH 10% 28 0.11
FHW0603UC7N5JST 7.5nH 5% 28 0.11
FHW0603UC7N5GST 7.5nH 2% 28 0.11
FHW0805UC7N5GGT 7.5nH 2% 35 0.15
FHW0805UC7N5JGT 7.5nH 5% 35 0.15
FHW0805UC7N5KGT 7.5nH 10% 35 0.15
FHW0603UC6N8JST 6.8nH 5% 27 0.11
FHW0603UC6N8KST 6.8nH 10% 27 0.11
FHW0603UC6N8GST 6.8nH 2% 27 0.11
FHW0805UC6N8GGT 6.8nH 2% 50 0.11
FHW0805UC6N8KGT 6.8nH 10% 50 0.11
FHW0805UC6N8JGT 6.8nH 5% 50 0.11
FHW0603UC6N2GST 6.2nH 2% 27 0.11
FHW0603UC6N2KST 6.2nH 10% 27 0.11
FHW0603UC6N2JST 6.2nH 5% 27 0.11
A total of 49 page 735 data