FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC027MGT 27nH ±20% 55@350MHz 1600 0.13
FHW0805UC027GGT 27nH ±2% 55@500MHz 2500 0.25
FHW0805UC027MGT 27nH ±20% 55@500MHz 2500 0.25
FHW0805UC027KGT 27nH ±10% 55@500MHz 2500 0.25
FHW0805UC027JGT 27nH ±5% 55@500MHz 2500 0.25
FHW0805UC027JGTCEG 27nH ±5% 55@500MHz 2500 0.25
FHW0805UC027JGTAEG 27nH ±5% 55@500MHz 2500 0.25
FHW0805UC027MGB 27nH ±20% 55@500MHz 2500 0.25
FHW0805UC027KGB 27nH ±10% 55@500MHz 2500 0.25
FHW0805UC027JGB 27nH ±5% 55@500MHz 2500 0.25
FHW1210HC022KGB 22nH ±10% 50@300MHz 2000 0.1
FHW1210HC022KGT 22nH ±10% 50@300MHz 2000 0.1
FHW1210HC022JGB 22nH ±5% 50@300MHz 2000 0.1
FHW1210HC022JGT 22nH ±5% 50@300MHz 2000 0.1
FHW1008UC022KGT 22nH ±10% 55@350MHz 2400 0.12
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