FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC022MGB 22nH ±20% 55@350MHz 2400 0.12
FHW1008UC022KGB 22nH ±10% 55@350MHz 2400 0.12
FHW1008UC022JGB 22nH ±5% 55@350MHz 2400 0.12
FHW1008UC022MGT 22nH ±20% 55@350MHz 2400 0.12
FHW1008UC022KGT 22nH ±10% 55@350MHz 2400 0.12
FHW1008UC022JGT 22nH ±5% 55@350MHz 2400 0.12
FHW1008UC022FGT 22nH 55@350MHz 2400 0.12
FHW0805UC022MGB 22nH ±20% 55@500MHz 2600 0.22
FHW0805UC022KGB 22nH ±10% 55@500MHz 2600 0.22
FHW0805UC022GGT 22nH ±2% 55@500MHz 2600 0.22
FHW0805UC022JGTCEG 22nH ±5% 55@500MHz 2600 0.22
FHW0805UC022MGT 22nH ±20% 55@500MHz 2600 0.22
FHW0805UC022KGT 22nH ±10% 55@500MHz 2600 0.22
FHW0805UC022JGT 22nH ±5% 55@500MHz 2600 0.22
FHW0805UC022JGB 22nH ±5% 55@500MHz 2600 0.22
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