FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0603UC4N3KST 4.3nH 10% 22 0.075
FHW0603UC4N3GST 4.3nH 2% 22 0.075
FHW1008UC4N3KGT 4.3nH 10% 50 0.04
FHW1008UC4N3JGT 4.3nH 5% 50 0.04
FHW0603UC3N9JST 3.9nH 5% 22 0.08
FHW0603UC3N9GST 3.9nH 2% 22 0.08
FHW0603UC3N9KST 3.9nH 10% 22 0.08
FHW1210HC3N9KGT 3.9nH 10% 30 0.05
FHW1008UC3N9KGT 3.9nH 10% 50 0.035
FHW1008UC3N9JGT 3.9nH 5% 50 0.035
FHW0603UC3N6JST 3.6nH 5% 22 0.075
FHW0603UC3N6KST 3.6nH 10% 22 0.075
FHW0603UC3N6GST 3.6nH 2% 22 0.075
FHW0603UC3N3KST 3.3nH 10% 20 0.075
FHW0805UC3N3KGT 3.3nH 10% 35 0.09
A total of 49 page 735 data