FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC022JGTAEG 22nH ±5% 55@500MHz 2600 0.22
FHW0805UC022GGB 22nH ±2% 55@500MHz 2600 0.22
FHW1210HC018JGT 18nH ±5% 50@300MHz 2800 0.1
FHW1210HC018GGT 18nH ±2% 50@300MHz 2800 0.1
FHW1210HC018JGB 18nH ±5% 50@300MHz 2800 0.1
FHW1210HC018KGB 18nH ±10% 50@300MHz 2800 0.1
FHW1210HC018KGT 18nH ±10% 50@300MHz 2800 0.1
FHW1008UC018MGB 18nH ±20% 50@350MHz 2500 0.11
FHW1008UC018KGT 18nH ±10% 50@350MHz 2500 0.11
FHW1008UC018JGT 18nH ±5% 50@350MHz 2500 0.11
FHW1008UC018GGT 18nH ±2% 50@350MHz 2500 0.11
FHW1008UC018MGT 18nH ±20% 50@350MHz 2500 0.11
FHW1008UC018JGB 18nH ±5% 50@350MHz 2500 0.11
FHW0805UC018JGB 18nH ±5% 55@500MHz 3300 0.2
FHW0805UC018MGT 18nH ±20% 55@500MHz 3300 0.2
A total of 60 page 894 data