FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC018KGT 18nH ±10% 55@500MHz 3300 0.2
FHW0805UC018JGTAEG 18nH ±5% 55@500MHz 3300 0.2
FHW0805UC018GGT 18nH ±2% 55@500MHz 3300 0.2
FHW0805UC018KGB 18nH ±10% 55@500MHz 3300 0.2
FHW0805UC018JGT 18nH ±5% 55@500MHz 3300 0.2
FHW0805UC018GGB 18nH ±2% 55@500MHz 3300 0.2
FHW0805UC018MGB 18nH ±20% 55@500MHz 3300 0.2
FHW1210HC015KGB 15nH ±10% 40@300MHz 3200 0.1
FHW1210HC015JGB 15nH ±5% 40@300MHz 3200 0.1
FHW1210HC015GGT 15nH ±2% 40@300MHz 3200 0.1
FHW1210HC015JGT 15nH ±5% 40@300MHz 3200 0.1
FHW1210HC015KGT 15nH ±10% 40@300MHz 3200 0.1
FHW1008UC015KGB 15nH ±10% 45@500MHz 2500 0.15
FHW1008UC015JGT 15nH ±5% 45@500MHz 2500 0.15
FHW1008UC015KGT 15nH ±10% 45@500MHz 2500 0.15
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