FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC3N0KGT 3nH 10% 35 0.09
FHW0805UC3N0JGT 3nH 5% 35 0.09
FHW0805UC2N7JGT 2.7nH 5% 50 0.045
FHW0805UC2N7GGT 2.7nH 2% 50 0.045
FHW0805UC2N7KGT 2.7nH 10% 50 0.045
FHW0805UC2N5KGT 2.5nH 10% 40 0.04
FHW0805UC2N5JGT 2.5nH 5% 40 0.04
FHW0603UC2N2KST 2.2nH 10% 12 0.09
FHW0805UC2N2KGT 2.2nH 10% 50 0.03
FHW0603UC2N0KST 2nH 10% 12 0.09
FHW0603UC2N0JST 2nH 5% 12 0.09
FHW0603UC1N8KST 1.8nH 10% 16 0.045
FHW0603UC1N7JST 1.7nH 5% 18 0.045
FHW0603UC1N7KST 1.7nH 10% 18 0.045
FHW0603UC1N6KST 1.6nH 10% 18 0.04
A total of 49 page 735 data