FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC3R9KGB 3.9µH ±10% 16@25MHz 60 3.6
FHW1008UC3R9KGT 3.9µH ±10% 16@25MHz 60 3.6
FHW1210IF3R3JST 3.3µH ±5% 12@7.96MHz 锡端头 1.1
FHW1210HC3R3GGT 3.3µH ±2% 20@25MHz 85 3.12
FHW1210HC3R3JGB 3.3µH ±5% 20@25MHz 85 3.12
FHW1210HC3R3KGB 3.3µH ±10% 20@25MHz 85 3.12
FHW1210HC3R3GGB 3.3µH ±2% 20@25MHz 85 3.12
FHW1210HC3R3JGT 3.3µH ±5% 20@25MHz 85 3.12
FHW1210HC3R3KGT 3.3µH ±10% 20@25MHz 85 3.12
FHW1008UC3R3JGT 3.3µH ±5% 22@25MHz 70 3.4
FHW1008UC3R3GGB 3.3µH ±2% 22@25MHz 70 3.4
FHW1008UC3R3JGB 3.3µH ±5% 22@25MHz 70 3.4
FHW1008UC3R3GGT 3.3µH ±2% 22@25MHz 70 3.4
FHW1008UC3R3KGB 3.3µH ±10% 22@25MHz 70 3.4
FHW1008UC3R3KGT 3.3µH ±10% 22@25MHz 70 3.4
A total of 60 page 894 data