FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC012KGT 12nH ±10% 40@300MHz 3200 0.08
FHW1210HC012GGT 12nH ±2% 40@300MHz 3200 0.08
FHW1210HC012JGT 12nH ±5% 40@300MHz 3200 0.08
FHW1008UC012KGB 12nH ±10% 50@500MHz 3300 0.09
FHW1008UC012MGB 12nH ±20% 50@500MHz 3300 0.09
FHW1008UC012JGT 12nH ±5% 50@500MHz 3300 0.09
FHW1008UC012MGT 12nH ±20% 50@500MHz 3300 0.09
FHW1008UC012GGT 12nH ±2% 50@500MHz 3300 0.09
FHW1008UC012KGT 12nH ±10% 50@500MHz 3300 0.09
FHW1008UC012JGB 12nH ±5% 50@500MHz 3300 0.09
FHW0805UC012MGB 12nH ±20% 50@500MHz 4000 0.15
FHW0805UC012JGB 12nH ±5% 50@500MHz 4000 0.15
FHW0805UC012MGT 12nH ±20% 50@500MHz 4000 0.15
FHW0805UC012GGT 12nH ±2% 50@500MHz 4000 0.15
FHW0805UC012JGT 12nH ±5% 50@500MHz 4000 0.15
A total of 60 page 894 data