FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC012KGT 12nH ±10% 50@500MHz 4000 0.15
FHW0805UC012GGB 12nH ±2% 50@500MHz 4000 0.15
FHW0805UC012JGTAEG 12nH ±5% 50@500MHz 4000 0.15
FHW1210HC010KGT 10nH ±10% 40@300MHz 4000 0.08
FHW1210HC010GGT 10nH ±2% 40@300MHz 4000 0.08
FHW1210HC010KGB 10nH ±10% 40@300MHz 4000 0.08
FHW1210HC010JGB 10nH ±5% 40@300MHz 4000 0.08
FHW1210HC010JGT 10nH ±5% 40@300MHz 4000 0.08
FHW1008UC010JGB 10nH ±5% 50@500MHz 4100 0.08
FHW1008UC010MGB 10nH ±20% 50@500MHz 4100 0.08
FHW1008UC010JGT 10nH ±5% 50@500MHz 4100 0.08
FHW1008UC010KGT 10nH ±10% 50@500MHz 4100 0.08
FHW1008UC010MGT 10nH ±20% 50@500MHz 4100 0.08
FHW1008UC010KGB 10nH ±10% 50@500MHz 4100 0.08
FHW1008UC010GGT 10nH ±2% 50@500MHz 4100 0.08
A total of 60 page 894 data