FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC010JGTAEG 10nH ±5% 50@500MHz 4200 0.15
FHW0805UC010GST 10nH ±2% 50@500MHz 4200 0.15
FHW0805UC010MGB 10nH ±20% 50@500MHz 4200 0.15
FHW0805UC010KGT 10nH ±10% 50@500MHz 4200 0.15
FHW0805UC010MGT 10nH ±20% 50@500MHz 4200 0.15
FHW0805UC010JGB 10nH ±5% 50@500MHz 4200 0.15
FHW0805UC010JGT 10nH ±5% 50@500MHz 4200 0.15
FHW0805UC010JGTCEG 10nH ±5% 50@500MHz 4200 0.15
FHW0805UC010GGT 10nH ±2% 50@500MHz 4200 0.15
FHW1210HC8N2JGB 8.2nH ±5% 30@300MHz 5500 0.07
FHW1210HC8N2KGB 8.2nH ±10% 30@300MHz 5500 0.07
FHW1210HC8N2JGT 8.2nH ±5% 30@300MHz 5500 0.07
FHW1210HC8N2KGT 8.2nH ±10% 30@300MHz 5500 0.07
FHW1008UC8N2KGT 8.2nH ±10% 50@1000MHz 5000 0.05
FHW1008UC8N2MGT 8.2nH ±20% 50@1000MHz 5000 0.05
A total of 60 page 894 data