FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC2R7JGB 2.7µH ±5% 25@25MHz 100 2.85
FHW1210HC2R7GGT 2.7µH ±2% 25@25MHz 100 2.85
FHW1210HC2R7FGT 2.7µH 25@25MHz 100 2.85
FHW1210HC2R7KGT 2.7µH ±10% 25@25MHz 100 2.85
FHW1210HC2R7FGB 2.7µH 25@25MHz 100 2.85
FHW1210HC2R7KGB 2.7µH ±10% 25@25MHz 100 2.85
FHW1210HC2R7JGT 2.7µH ±5% 25@25MHz 100 2.85
FHW1008UC2R7GGT 2.7µH ±2% 22@25MHz 80 3.2
FHW1008UC2R7GGB 2.7µH ±2% 22@25MHz 80 3.2
FHW1008UC2R7KGT 2.7µH ±10% 22@25MHz 80 3.2
FHW1008UC2R7KGB 2.7µH ±10% 22@25MHz 80 3.2
FHW1008UC2R7JGT 2.7µH ±5% 22@25MHz 80 3.2
FHW1008UC2R7JGB 2.7µH ±5% 22@25MHz 80 3.2
FHW1210IF2R2JST 2.2µH ±5% 12@7.96MHz 锡端头 0.6
FHW0604PF2R2KST-CN 2.2µH 锡端头
A total of 60 page 894 data