FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC1R5KGT 1.5µH 10% 30 1.95
FHW1210HC1R5JGT 1.5µH 5% 30 1.95
FHW1210HC1R5GGT 1.5µH 2% 30 1.95
FHW1008UC1R5GGT 1.5µH 2% 28 2.3
FHW1008UC1R5JGT 1.5µH 5% 28 2.3
FHW1008UC1R5KGT 1.5µH 10% 28 2.3
FHW0805UC1R5JGT 1.5µH 5% 18 2.8
FHW0805UC1R5KGT 1.5µH 10% 18 2.8
FHW1210HC1R3GGT 1.3µH 2% 35 1.9
FHW1210HC1R3JGT 1.3µH 5% 35 1.9
FHW1210HC1R3KGT 1.3µH 10% 35 1.9
FHW1210HC1R2JGT 1.2µH 5% 35 1.87
FHW1210HC1R2KGT 1.2µH 10% 35 1.87
FHW1210HC1R2GGT 1.2µH 2% 35 1.87
FHW1008UC1R2GGT 1.2µH 2% 35 2
A total of 49 page 735 data