FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC2N7DGT 2.7nH ±0.5nH 50@1500MHz 8000 0.045
FHW0805UC2N2DGT 2.2nH ±0.5nH 50@1500MHz 8500 0.03
FHW0805UC2N2JGT 2.2nH ±5% 50@1500MHz 8500 0.03
FHW0805UC2N2KGT 2.2nH ±10% 50@1500MHz 8500 0.03
FHW0805UC2N2JGB 2.2nH ±5% 50@1500MHz 8500 0.03
FHW0805UC2N2MGT 2.2nH ±20% 50@1500MHz 8500 0.03
FHW0805UC2N2SGT 2.2nH ±0.3nH 50@1500MHz 8500 0.03
FHW0805UC2N2KGB 2.2nH ±10% 50@1500MHz 8500 0.03
FHW0805UC2N2GGT 2.2nH ±2% 50@1500MHz 8500 0.03
A total of 60 page 894 data