FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC1R2KGT 1.2µH 10% 35 2
FHW1008UC1R2GGT 1.2µH 2% 35 2
FHW0805UC1R2KGT 1.2µH 10% 18 2.55
FHW0805UC1R2JGT 1.2µH 5% 18 2.55
FHW1210HC1R0GGT 1.0µH 2% 45 1.85
FHW1210HC1R0KGT 1.0µH 10% 45 1.85
FHW1210HC1R0JGT 1.0µH 5% 45 1.85
FHW1008UC1R0GGT 1.0µH 2% 35 1.75
FHW1008UC1R0JGT 1.0µH 5% 35 1.75
FHW1008UC1R0KGT 1.0µH 10% 35 1.75
FHW0805UC1R0JGT 1.0µH 5% 20 2.4
FHW0805UC1R0KGT 1.0µH 10% 20 2.4
FHW0805UCR91KGT 910nH 10% 20 2.28
FHW0805UCR91JGT 910nH 5% 20 2.28
FHW1210HCR91KGT 910nH 10% 45 1.85
A total of 49 page 735 data