FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0604PF2R2KST 2.2µH 锡端头
FHW1210HC2R2JGT 2.2µH ±5% 30@50MHz 110 2.41
FHW1210HC2R2KGT 2.2µH ±10% 30@50MHz 110 2.41
FHW1210HC2R2JGB 2.2µH ±5% 30@50MHz 110 2.41
FHW1210HC2R2KGB 2.2µH ±10% 30@50MHz 110 2.41
FHW1210HC2R2GGT 2.2µH ±2% 30@50MHz 110 2.41
FHW1210HC2R2JGTAEG 2.2µH ±5% 30@50MHz 110 2.41
FHW1008UC2R2GGT 2.2µH ±2% 20@50MHz 90 2.8
FHW1008UC2R2KGT 2.2µH ±10% 20@50MHz 90 2.8
FHW1008UC2R2JGT 2.2µH ±5% 20@50MHz 90 2.8
FHW1008UC2R2KGB 2.2µH ±10% 20@50MHz 90 2.8
FHW1008UC2R2GGB 2.2µH ±2% 20@50MHz 90 2.8
FHW1008UC2R2JGB 2.2µH ±5% 20@50MHz 90 2.8
FHW0805UC2R2JGB 2.2µH ±5% 16@7.9MHz 50 4.2
FHW0805UC2R2JGTAEG 2.2µH ±5% 16@7.9MHz 50 4.2
A total of 60 page 894 data