FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC2R2JGB 2.2µH ±5% 16@7.9MHz 50 4.2
FHW0805UC2R2JGTAEG 2.2µH ±5% 16@7.9MHz 50 4.2
FHW0805UC2R2KGT 2.2µH ±10% 16@7.9MHz 50 4.2
FHW0805UC2R2GGT 2.2µH ±2% 16@7.9MHz 50 4.2
FHW1210HC1R8JGB 1.8µH ±5% 30@50MHz 160 2.25
FHW1210HC1R8JGT 1.8µH ±5% 30@50MHz 160 2.25
FHW1210HC1R8GGT 1.8µH ±2% 30@50MHz 160 2.25
FHW1210HC1R8KGB 1.8µH ±10% 30@50MHz 160 2.25
FHW1210HC1R8KGT 1.8µH ±10% 30@50MHz 160 2.25
FHW1210HC1R8KYT 1.8µH ±10% 30@50MHz 160 2.25
FHW1210HC1R8FGT 1.8µH 30@50MHz 160 2.25
FHW1008UC1R8FGB 1.8µH 28@50MHz 160 2.6
FHW1008UC1R8GGT 1.8µH ±2% 28@50MHz 160 2.6
FHW1008UC1R8FGT 1.8µH 28@50MHz 160 2.6
FHW1008UC1R8JGB 1.8µH ±5% 28@50MHz 160 2.6
A total of 60 page 894 data