FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR82JGT 820nH 5% 23 2.14
FHW1210HCR75KGT 750nH 10% 45 1.7
FHW1210HCR75GGT 750nH 2% 45 1.7
FHW1210HCR75JGT 750nH 5% 45 1.7
FHW0805UCR75KGT 750nH 10% 23 2.12
FHW0805UCR75JGT 750nH 5% 23 2.12
FHW1008UCR75GGT 750nH 2% 45 1.54
FHW1008UCR75JGT 750nH 5% 45 1.54
FHW1008UCR75KGT 750nH 10% 45 1.54
FHW1210HCR68JGT 680nH 5% 45 1.2
FHW1210HCR68GGT 680nH 2% 45 1.2
FHW1210HCR68KGT 680nH 10% 45 1.2
FHW1008UCR68JGT 680nH 5% 45 1.47
FHW1008UCR68KGT 680nH 10% 45 1.47
FHW1008UCR68GGT 680nH 2% 45 1.47
A total of 49 page 735 data