FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC1R8KGT 1.8µH ±10% 28@50MHz 160 2.6
FHW1008UC1R8JGT 1.8µH ±5% 28@50MHz 160 2.6
FHW1008UC1R8KGB 1.8µH ±10% 28@50MHz 160 2.6
FHW0805UC1R8KGT 1.8µH ±10% 18@50MHz 140 3.8
FHW0805UC1R8JGT 1.8µH ±5% 18@50MHz 140 3.8
FHW0805UC1R8FGB 1.8µH 18@50MHz 140 3.8
FHW0805UC1R8GGT 1.8µH ±2% 18@50MHz 140 3.8
FHW0805UC1R8FGT 1.8µH 18@50MHz 140 3.8
FHW0805UC1R8JGB 1.8µH ±5% 18@50MHz 140 3.8
FHW0805UC1R8JGTAEG 1.8µH ±5% 18@50MHz 140 3.8
FHW1210HC1R5MGT 1.5µH ±20% 30@50MHz 160 1.95
FHW1210HC1R5FGT 1.5µH 30@50MHz 160 1.95
FHW1210HC1R5JGB 1.5µH ±5% 30@50MHz 160 1.95
FHW1210HC1R5KGB 1.5µH ±10% 30@50MHz 160 1.95
FHW1210HC1R5GGT 1.5µH ±2% 30@50MHz 160 1.95
A total of 60 page 894 data